The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
May. 08, 2017
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventor:
Young Hoon Kwark, Yorktown Heights, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/13 (2006.01); H01L 23/66 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/481 (2013.01); H01L 21/4882 (2013.01); H01L 23/13 (2013.01); H01L 23/3672 (2013.01); H01L 23/3677 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/40 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 25/165 (2013.01); H05K 1/183 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/40105 (2013.01); H01L 2224/40237 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/49433 (2013.01); H01L 2224/73221 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/1903 (2013.01); H01L 2924/19031 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H05K 2201/092 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/049 (2013.01);
Abstract
A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, and electrically connecting the integrated circuit chip to the embedded conductor.