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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10600707 B1

PDFFull Text
Date of Patent:
Mar. 24, 2020

Filed:

Jul. 20, 2018

Fiber-containing resin substrate, encapsulated semiconductor devices mounting substrate, encapsulated semiconductor devices forming wafer, encapsulated semiconductor devices mounting sheet, semiconductor equipment, and method for manufacturing semiconductor equipment

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Yoshihiro Tsutsumi, Annaka, JP;

Shuichi Fujii, Maebashi, JP;

Kenji Hagiwara, Annaka, JP;

Shinsuke Yamaguchi, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Thao P Le

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/29 (2006.01); B29C 70/68 (2006.01); C08L 63/00 (2006.01); C08G 59/62 (2006.01); C08G 59/40 (2006.01); C08G 59/24 (2006.01); B29L 31/34 (2006.01); B29C 70/70 (2006.01); B29K 63/00 (2006.01); B29C 70/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); B29C 70/681 (2013.01); C08G 59/245 (2013.01); C08G 59/4021 (2013.01); C08G 59/621 (2013.01); C08L 63/00 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/293 (2013.01); B29C 70/086 (2013.01); B29C 70/70 (2013.01); B29K 2063/00 (2013.01); B29L 2031/3481 (2013.01); C08L 2205/02 (2013.01); H01L 21/561 (2013.01);
Abstract

A fiber-containing resin substrate includes a thermosetting epoxy resin-impregnated fiber base material, and an uncured resin layer formed on one side thereof formed from a composition containing: (A) a crystalline bisphenol A type epoxy resin and/or a crystalline bisphenol F type epoxy resin, (B) an epoxy resin that is non-fluid at 25° C. other than the component (A), (C) a phenol compound having two or more phenolic hydroxy groups in one molecule, (D) an inorganic filler, and (E) an urea-based curing accelerator. The fiber-containing resin substrate collectively encapsulates a semiconductor devices mounting surface or a semiconductor devices forming surface on a wafer level, even when a large-diameter wafer or a large-diameter substrate is encapsulated, to reduce warpage of the substrate or the wafer and peeling of a semiconductor device from the substrate, and to have the uncured resin layer excellent in storage stability and handleability before curing.

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