The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Oct. 05, 2017
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Jin Seong Kim, Suwon-si, KR;
Sung Sik Shin, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/24 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 27/255 (2006.01); H01F 41/04 (2006.01); H01F 27/245 (2006.01); H01F 27/29 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/245 (2013.01); H01F 27/255 (2013.01); H01F 41/04 (2013.01); H01F 41/046 (2013.01); H01F 27/2823 (2013.01); H01F 27/292 (2013.01);
Abstract
A coil electronic component includes a base layer, a stacked structure of a plurality of coil patterns disposed on the base layer, and a buildup layer disposed between at least two coil patterns of the plurality of coil patterns, the buildup layer at least partially covering the coil patterns and having sintering properties different from those of the base layer.