The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Jul. 07, 2015
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventor:
Shin-ichi Ogino, Ibaraki, JP;
Assignee:
JX NIPPON MINING & METALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 5/04 (2006.01); C22C 1/10 (2006.01); C23C 14/34 (2006.01); C22C 1/04 (2006.01); C22C 29/00 (2006.01); B22F 3/15 (2006.01); C23C 14/16 (2006.01); H01F 1/06 (2006.01); H01F 41/18 (2006.01); H01J 37/34 (2006.01); G11B 5/851 (2006.01); C22F 1/00 (2006.01);
U.S. Cl.
CPC ...
G11B 5/851 (2013.01); B22F 3/15 (2013.01); C22C 1/0466 (2013.01); C22C 1/1084 (2013.01); C22C 5/04 (2013.01); C22C 29/00 (2013.01); C22F 1/00 (2013.01); C23C 14/165 (2013.01); C23C 14/3407 (2013.01); C23C 14/3414 (2013.01); H01F 1/068 (2013.01); H01F 41/183 (2013.01); H01J 37/3405 (2013.01); H01J 37/3429 (2013.01); B22F 2998/10 (2013.01);
Abstract
An FePt-based sintered sputtering target containing C and/or BN, wherein an area ratio of AgCu alloy grains on a polished surface of a cross section that is perpendicular to a sputtered surface of the sputtering target is 0.5% or more and 15% or less. An object of this invention is to provide a sputtering target capable of reducing particles generation during sputtering and efficiently depositing a magnetic thin film of a magnetic recording medium.