The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Jul. 17, 2019
Applicant:

Coretronic Corporation, Hsin-Chu, TW;

Inventors:

Chi-Tang Hsieh, Hsin-Chu, TW;

Chia-Lun Tsai, Hsin-Chu, TW;

Jo-Han Hsu, Hsin-Chu, TW;

Assignee:

Coretronic Corporation, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 21/20 (2006.01); B32B 7/12 (2006.01); B32B 37/18 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
G03B 21/204 (2013.01); B32B 7/12 (2013.01); B32B 37/1207 (2013.01); B32B 37/18 (2013.01); B32B 2307/416 (2013.01); B32B 2307/42 (2013.01); B32B 2307/422 (2013.01); B32B 2551/00 (2013.01);
Abstract

A wavelength conversion module including a substrate and a wavelength conversion layer is provided. The substrate includes an axis, and the axis is located at the center of the substrate. The wavelength conversion layer is located on the substrate and includes two first wavelength conversion layers and a second wavelength conversion layer. Each of the first wavelength conversion layers includes a wavelength conversion material and a first bonding material. The second wavelength conversion layer is located between the two first wavelength conversion layers in a radial direction from the axis of the substrate to an edge of the substrate, and the second wavelength conversion layer includes the wavelength conversion material and a second bonding material. The first bonding material is different from the second bonding material. Moreover, a projection device and a forming method of the wavelength conversion module are also provided.


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