The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Aug. 08, 2014
Applicant:

United Technologies Corporation, Hartford, CT (US);

Inventors:

Lyutsia Dautova, Rocky Hill, CT (US);

Wendell V. Twelves, Jr., Glastonbury, CT (US);

Joe Ott, Enfield, CT (US);

Evan Butcher, Manchester, CT (US);

Gary A. Schirtzinger, Glastonbury, CT (US);

Rainer J. Herbert, Ellington, CT (US);

Assignee:

United Technologies Corporation, Farmington, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 5/04 (2006.01); B33Y 40/00 (2015.01); B33Y 10/00 (2015.01); B23K 26/342 (2014.01); G01L 1/25 (2006.01); G01N 23/20 (2018.01); B22F 3/105 (2006.01); F01D 21/00 (2006.01); B23K 26/70 (2014.01); B23K 103/14 (2006.01);
U.S. Cl.
CPC ...
G01L 1/25 (2013.01); B22F 3/1055 (2013.01); B22F 5/04 (2013.01); B23K 26/342 (2015.10); B23K 26/702 (2015.10); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); F01D 21/003 (2013.01); G01N 23/20 (2013.01); B22F 2003/1056 (2013.01); B23K 2103/14 (2018.08); Y02P 10/295 (2015.11);
Abstract

A method of monitoring the residual stress in surface and near surface regions of a component includes identifying predetermined locations on the surface of a component that are expected to experience high stress during normal operating conditions of the component. Marker particles are introduced into the component during additive manufacture of the component at the predetermined locations. Then, the residual stress of the component is measured at a location corresponding with the marker material using x-ray techniques.


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