The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Feb. 04, 2019
Applicant:
Molex, Llc, Lisle, IL (US);
Inventors:
Victor Zaderej, Wheaton, IL (US);
Daniel B. McGowan, Glen Ellyn, IL (US);
Assignee:
Molex, LLC, Lisle, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 23/06 (2006.01); F21S 4/00 (2016.01); F21V 23/00 (2015.01); F21S 4/28 (2016.01); F21K 9/20 (2016.01); F21V 19/00 (2006.01); H05K 1/00 (2006.01); H01L 25/075 (2006.01); F21Y 103/10 (2016.01); F21Y 115/10 (2016.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
F21V 23/001 (2013.01); F21K 9/20 (2016.08); F21S 4/28 (2016.01); F21V 19/0025 (2013.01); F21V 23/06 (2013.01); H01L 25/0753 (2013.01); H05K 1/00 (2013.01); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08); H01L 33/62 (2013.01);
Abstract
An assembly is provided that includes a semiconductor device positioned on a frame and connected to electroplated traces via wire bonding. A connector can be integrated into the frame. Terminals can be molded into the frame. Traces can be connected to the terminals so as to provide a three-dimensional circuit.