The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Aug. 11, 2015
Applicant:

Kobe Steel, Ltd., Kobe-shi, JP;

Inventors:

Minoru Chida, Kakogawa, JP;

Hiroshi Irie, Kakogawa, JP;

Assignee:

Kobe Steel, Ltd., Kobe-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 2/06 (2006.01); C23C 2/40 (2006.01); C23C 2/02 (2006.01); C21D 9/46 (2006.01); C21D 6/00 (2006.01); C21D 1/26 (2006.01); C22C 38/38 (2006.01); C22C 38/32 (2006.01); C22C 38/22 (2006.01); C22C 38/14 (2006.01); C22C 38/12 (2006.01); C22C 38/06 (2006.01); C22C 38/04 (2006.01); C22C 38/02 (2006.01); C22C 38/00 (2006.01); B32B 15/01 (2006.01); C22C 38/34 (2006.01); C22C 38/26 (2006.01); C22C 38/28 (2006.01); C21D 1/76 (2006.01); C23C 2/26 (2006.01); C23C 30/00 (2006.01); C23C 2/04 (2006.01); B32B 15/04 (2006.01); C23C 2/12 (2006.01); C23C 2/28 (2006.01); B32B 15/18 (2006.01); C21D 1/74 (2006.01);
U.S. Cl.
CPC ...
C23C 2/06 (2013.01); B32B 15/012 (2013.01); B32B 15/013 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); C21D 1/26 (2013.01); C21D 1/76 (2013.01); C21D 6/005 (2013.01); C21D 6/008 (2013.01); C21D 9/46 (2013.01); C22C 38/00 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/12 (2013.01); C22C 38/14 (2013.01); C22C 38/22 (2013.01); C22C 38/26 (2013.01); C22C 38/28 (2013.01); C22C 38/32 (2013.01); C22C 38/34 (2013.01); C22C 38/38 (2013.01); C23C 2/02 (2013.01); C23C 2/04 (2013.01); C23C 2/12 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/40 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C21D 1/74 (2013.01); Y10T 428/12757 (2015.01); Y10T 428/12792 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12958 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/12979 (2015.01); Y10T 428/12993 (2015.01);
Abstract

Provided is a technique in which a reduction annealing method is used to efficiently produce a high-strength hot-dip galvanizing substrate or high-strength hot-dip galvannealing substrate, which is useful as a raw material for producing a high-strength plated steel sheet suppressed in the occurrence of bare spot. The substrate for hot-dip galvanizing or hot-dip galvannealing of the present invention satisfies the following condition: when the mapping intensity of Fe, which is obtained by using an electron probe microanalyser in a measurement field of view of 33.6 μm×41.4 μm on the surface after reduction annealing, of 0 to 240 is divided into 16 parts at an interval of 15, the area occupied by a mapping intensity of 195 or more has 70% or more.


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