The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Apr. 03, 2015
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo-to, JP;
Inventors:
Assignee:
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 73/10 (2006.01); C09D 7/40 (2018.01); C09D 163/00 (2006.01); C09J 5/02 (2006.01); C09J 7/00 (2018.01); E04G 23/02 (2006.01); C09J 201/00 (2006.01); C09J 11/06 (2006.01); C09J 5/00 (2006.01); B29C 35/08 (2006.01); C09D 5/00 (2006.01); B29K 63/00 (2006.01); B29K 105/00 (2006.01); B29K 105/08 (2006.01); B29L 31/00 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C09D 7/40 (2018.01); B29C 35/0805 (2013.01); B29C 35/0866 (2013.01); B29C 73/10 (2013.01); C09D 5/002 (2013.01); C09D 163/00 (2013.01); C09J 5/00 (2013.01); C09J 5/02 (2013.01); C09J 7/00 (2013.01); C09J 11/06 (2013.01); C09J 201/00 (2013.01); E04G 23/02 (2013.01); B29C 2035/0833 (2013.01); B29C 2035/0872 (2013.01); B29K 2063/00 (2013.01); B29K 2105/0097 (2013.01); B29K 2105/0809 (2013.01); B29L 2031/776 (2013.01); C09J 163/00 (2013.01); C09J 2205/31 (2013.01); C09J 2453/00 (2013.01); C09J 2463/00 (2013.01); C09J 2463/008 (2013.01);
Abstract
There is provided a method for repairing or reinforcing a structure. The method includes the steps of: providing an adhesive sheet comprising an adhesive layer comprising at least a curable resin composition whose curing is promoted by irradiation with ionizing radiation and a curing aid which generates a basic substance by irradiation with ionizing radiation; attaching the adhesive sheet to a surface of the structure; and curing the adhesive layer of the adhesive sheet in a state where the adhesive layer is exposed.