The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Feb. 28, 2017
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;
Inventors:
Yuko Nakamata, Kawasaki, JP;
Yuji Ichimura, Kawasaki, JP;
Assignee:
Fuji Electric Co., Ltd., , JP;
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); H01L 23/29 (2006.01); C08G 59/22 (2006.01); C08G 59/42 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/226 (2013.01); C08G 59/4215 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01); H01L 23/3114 (2013.01); H01L 24/48 (2013.01); H01L 24/69 (2013.01); H01L 29/16 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); C08L 2201/08 (2013.01); C08L 2203/206 (2013.01); H01L 23/24 (2013.01); H01L 24/40 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/69 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01);
Abstract
A resin composition is disclosed that includes a thermosetting base resin; a curing agent; an inorganic filler; and at least one fluorine resin powder selected from polyvinylidene fluoride, polychlorotrifluoroethylene, and a tetrafluoroethylene/perfluoro(alkyl vinyl ether)/chlorotrifluoroethylene copolymer, and a semiconductor device which is fabricated by being sealed using a sealant formed of the resin composition.