The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Jun. 26, 2013
Applicant:

Kaneka Corporation, Osaka-shi, Osaka, JP;

Inventors:

Fuminobu Kitayama, Hyogo, JP;

Nobuyoshi Maizuru, Hyogo, JP;

Keisuke Hatano, Osaka, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 33/12 (2006.01); C08F 265/06 (2006.01); C08L 51/04 (2006.01); C08L 51/06 (2006.01); G02B 1/04 (2006.01); C08J 5/18 (2006.01); C08L 33/08 (2006.01);
U.S. Cl.
CPC ...
C08L 33/12 (2013.01); C08F 265/06 (2013.01); C08J 5/18 (2013.01); C08L 33/08 (2013.01); C08L 51/04 (2013.01); C08L 51/06 (2013.01); G02B 1/04 (2013.01); C08J 2333/08 (2013.01); C08J 2333/12 (2013.01); C08J 2433/08 (2013.01); C08J 2433/12 (2013.01); C08L 2203/16 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01);
Abstract

An object of the present invention is to provide a resin material capable of producing a molded body having few defects due to foreign substances, having high mechanical strength, very small in both orientation birefringence and photoelastic birefringence, and having high transparency, and having high transparency even when such a resin material is stretched. Provided is a resin composition containing a resin (A) and a multilayer structure polymer (B), wherein the multilayer structure polymer (B) has a crosslinked polymer layer and a hard polymer layer, and the hard polymer layer has at least two different hard polymer layers, at least one of which is a hard polymer layer (C) opposite in sign of a photoelastic constant to that of the resin (A).


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