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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10597512 B1

PDFFull Text
Date of Patent:
Mar. 24, 2020

Filed:

Apr. 13, 2016

Optoelectronic device with a mixture having a silicone and a fluoro-organic additive

Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Klaus Höhn, Forchheim, DE;

Kathy Schmidtke, Mainburg, DE;

Christina Keith, Neutraubling, DE;

Assignee:

OSRAM OPTO SEMICONDUCTORS GMBH, Regensburg, DE;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Brook Kebede

Int. Cl.
CPC ...
H01L 33/00 (2010.01); C08K 5/05 (2006.01); H01L 33/56 (2010.01); C08L 83/04 (2006.01); C08K 5/02 (2006.01); C08L 83/00 (2006.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01); H01L 31/024 (2014.01); H01L 33/58 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
C08K 5/05 (2013.01); C08K 5/02 (2013.01); C08L 83/00 (2013.01); C08L 83/04 (2013.01); H01L 31/0203 (2013.01); H01L 31/024 (2013.01); H01L 31/02327 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 33/641 (2013.01); C08L 2203/206 (2013.01); C08L 2205/025 (2013.01); H01L 2224/32225 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0075 (2013.01);
Abstract

An optoelectronic device with a mixture including silicone and a fluoro-organic additive is disclosed. In an embodiment the device includes at least one radiation-emitting or radiation-detecting semiconductor and a mixture including silicone and a fluoro-organic additive. The mixture may be a component of at least one of the following elements: a package body element surrounding the at least one semiconductor at least in places, a radiation-guiding element arranged in a beam path of a radiation emitted by the semiconductor or detected by the semiconductor, a heat-conducting element configured to conduct heat emitted by the semiconductor or received by the semiconductor, or an adhesive element.

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