The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

May. 16, 2019
Applicant:

Magna Electronics Inc., Auburn Hills, MI (US);

Inventors:

Robert L. Bingle, Holland, MI (US);

Joseph Camilleri, Brighton, MI (US);

Peter J. Whitehead, Grand Rapids, MI (US);

Kenneth Schofield, Holland, MI (US);

Assignee:

MAGNA ELECTRONICS INC., Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60R 11/04 (2006.01); B60R 16/03 (2006.01); H04N 5/374 (2011.01); G03B 29/00 (2006.01); H04N 5/225 (2006.01); H04N 7/18 (2006.01); B60S 1/56 (2006.01); G03B 17/02 (2006.01); B60R 1/02 (2006.01); B60R 1/04 (2006.01); B60R 1/12 (2006.01); B60S 1/04 (2006.01); B60R 11/00 (2006.01); B60Q 1/14 (2006.01); G06K 9/00 (2006.01); H04N 5/33 (2006.01);
U.S. Cl.
CPC ...
B60R 11/04 (2013.01); B60R 1/02 (2013.01); B60R 1/04 (2013.01); B60R 1/12 (2013.01); B60R 16/03 (2013.01); B60S 1/0411 (2013.01); B60S 1/56 (2013.01); G03B 17/02 (2013.01); G03B 29/00 (2013.01); H04N 5/2252 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/2257 (2013.01); H04N 5/374 (2013.01); H04N 7/183 (2013.01); B60Q 1/1423 (2013.01); B60R 2001/1215 (2013.01); B60R 2011/004 (2013.01); B60R 2011/008 (2013.01); B60R 2011/0082 (2013.01); B60R 2011/0084 (2013.01); B60R 2011/0094 (2013.01); B60R 2300/101 (2013.01); B60R 2300/602 (2013.01); B60R 2300/8046 (2013.01); G06K 9/00791 (2013.01); H04N 5/332 (2013.01);
Abstract

A vehicular camera module includes a camera having an image sensor and a lens. The image sensor is disposed at a first printed circuit board, and a second printed circuit board is in board-to-board electrical connection with the first printed circuit board. Board-to-board electrical connection between the first and second printed circuit boards is via a multi-wire ribbon connection. A housing houses the first and second printed circuit boards. The housing is configured for mounting at a windshield of a vehicle and, with the vehicular camera module mounted at the windshield of the vehicle, the camera has a field of view external of the vehicle. With the vehicular camera module mounted at the windshield of the vehicle and responsive at least in part to processing by an image processor of image data captured by the image sensor, an object in the field of view of the camera is detected.


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