The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Jan. 25, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Dong-ki Kim, Seoul, KR;

Jei-young Lee, Yongin-si, KR;

Young-hwan Kim, Hwaseong-si, KR;

Min-woo Seo, Seongnam-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2017.01); B33Y 50/02 (2015.01); G01N 29/04 (2006.01); G01N 29/44 (2006.01); B33Y 10/00 (2015.01); G01N 29/34 (2006.01); G01N 29/06 (2006.01); G01N 29/11 (2006.01); B29C 64/106 (2017.01); B29C 64/393 (2017.01); B29C 64/321 (2017.01); B29C 64/386 (2017.01); B33Y 30/00 (2015.01); G01N 3/40 (2006.01); G01N 21/3563 (2014.01); G01N 21/3581 (2014.01);
U.S. Cl.
CPC ...
B33Y 10/00 (2014.12); B29C 64/106 (2017.08); B29C 64/321 (2017.08); B29C 64/386 (2017.08); B29C 64/393 (2017.08); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); G01N 3/40 (2013.01); G01N 21/3563 (2013.01); G01N 21/3581 (2013.01); G01N 29/04 (2013.01); G01N 29/0654 (2013.01); G01N 29/11 (2013.01); G01N 29/348 (2013.01); G01N 29/4454 (2013.01); G01N 2203/0055 (2013.01); G01N 2203/0647 (2013.01); G01N 2203/0658 (2013.01); G01N 2291/015 (2013.01); G01N 2291/02827 (2013.01); G01N 2291/106 (2013.01);
Abstract

A sensing device capable of detecting hardness includes a sensor array including a plurality of sensors, each of the plurality of sensors including a transmitter configured to emit a detection wave and a receiver configured to receive a reflected detection wave reflected by an object, the plurality of sensors arranged in a matrix form; and a controller configured to obtain image information and hardness information of each portion of the object from the reflected waves received by the plurality of sensors, and to form three-dimensional print data by mapping the image information and the hardness information.


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