The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Jan. 27, 2017
Applicant:

Fujifilm Sonosite, Inc., Bothell, WA (US);

Inventors:

N. Christopher Chaggares, Whitby, CA;

Eric Rieder, Georgetown, CA;

Assignee:

Fujifilm Sonosite, Inc., Bothell, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/04 (2006.01); B06B 1/06 (2006.01); H01L 41/047 (2006.01); H01L 41/293 (2013.01); B06B 1/02 (2006.01); H05K 1/02 (2006.01); H05K 3/06 (2006.01); H05K 3/32 (2006.01); H05K 1/18 (2006.01); H05K 3/02 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
B06B 1/0629 (2013.01); B06B 1/0207 (2013.01); B06B 1/0622 (2013.01); H01L 41/0475 (2013.01); H01L 41/293 (2013.01); H05K 1/028 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); H05K 3/02 (2013.01); H05K 3/064 (2013.01); H05K 3/305 (2013.01); H05K 3/32 (2013.01); H05K 2203/0361 (2013.01);
Abstract

The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.


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