The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Sep. 12, 2014
Applicant:

Straumann Holding Ag, Basel, CH;

Inventors:

Frank Homann, Munich, DE;

Philippe Habersetzer, Rixheim, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61C 8/00 (2006.01); C09K 13/08 (2006.01); C04B 41/91 (2006.01); C04B 41/53 (2006.01); C04B 41/00 (2006.01); A61K 6/02 (2006.01); A61C 13/00 (2006.01); A61C 13/20 (2006.01); A61L 27/10 (2006.01); C23F 1/30 (2006.01); C04B 111/00 (2006.01);
U.S. Cl.
CPC ...
A61C 8/0012 (2013.01); A61C 8/0037 (2013.01); A61C 13/00 (2013.01); A61C 13/206 (2013.01); A61K 6/024 (2013.01); A61K 6/0255 (2013.01); A61L 27/10 (2013.01); C04B 41/009 (2013.01); C04B 41/5353 (2013.01); C04B 41/91 (2013.01); C23F 1/30 (2013.01); A61C 2008/0046 (2013.01); A61L 2430/12 (2013.01); C04B 2111/00836 (2013.01);
Abstract

A process for providing a topography to the surface of a dental implant, the surface being made of a ceramic material having yttria-stabilized zirconia, the process including: providing a macroscopic roughness to the surface of the dental implant by a mechanical process and/or injection molding technique; and etching at least a part of the roughened surface, wherein etching is carried out using an etching solution having hydrofluoric acid at a temperature of 70° C. at least, such that discrete grains or agglomerates of grains are removed from the yttria-stabilized zirconia, thereby forming recesses and cavities in the roughened surface is disclosed.


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