The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Apr. 03, 2019
Applicants:

Martin Brokner Christiansen, Laurel, MD (US);

Steven Ward Van Sciver, Easton, PA (US);

Inventors:

Martin Brokner Christiansen, Laurel, MD (US);

Steven Ward Van Sciver, Easton, PA (US);

Assignee:

NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 7/14 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/205 (2013.01); H05K 1/0213 (2013.01);
Abstract

A heat sink includes a plurality of apertures extending therethrough. The heat sink is arranged substantially parallel to a circuit board and includes at least one aperture transversely aligned with a corresponding IC chip of the circuit board. An underside of the heat sink is structurally connected to the circuit board. A plurality of thermal bridges is provided. Each thermal bridge includes a center bridge pad and at least one footer pad, connected via at least one offset wire. Each thermal bridge is aligned with a corresponding aperture. An underside of each footer pad is attached to the heat sink, with the offset wire extending into the corresponding aperture to suspend the center bridge pad at least partially into the aperture above the IC chip, thus creating a thermal load path. The apparatus separates a thermal load path from a structural load path in a circuit board environment.


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