The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Mar. 02, 2018
Applicant:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Inventors:

John A. Starkovich, Redondo Beach, CA (US);

Edward M. Silverman, Encino, CA (US);

Andrew D. Kostelec, Fullerton, CA (US);

Assignee:

NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 21/02 (2006.01); F28F 3/00 (2006.01); F28F 13/00 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20436 (2013.01); F28F 3/00 (2013.01); F28F 21/02 (2013.01); H01L 23/373 (2013.01); H01L 23/3737 (2013.01); H01L 23/433 (2013.01); F28F 2013/006 (2013.01);
Abstract

An exemplary passive heat transfer apparatus is suited for transferring heat away from an electronic heat generating device to another environment. A gasket has many spaced-apart holes that are transverse to two major opposing surfaces of the gasket. A thermally conductive material is disposed within and fills the holes for conducting heat from one of the two major surfaces to the other major surface. The thermally conductive material is a nanocomposite material having nano-particles aligned substantially perpendicular to the two major opposing surfaces. The thermally conductive material as disposed in the holes has no interfacial boundaries that could adversely affect the transfer of heat.


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