The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Dec. 27, 2016
Applicants:
Boe Technology Group Co., Ltd., Beijing, CN;
Ordos Yuansheng Optoelectronics Co., Ltd., Ordos, CN;
Inventors:
Assignees:
BOE TECHNOLOGY GROUP CO., LTD, Beijing, CN;
ORDOS YUANSHENG OPTOELECTRONICS CO., LTD, Ordos, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 1/02 (2006.01); H05K 5/03 (2006.01); H05K 5/06 (2006.01); H05K 7/20 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0017 (2013.01); H05K 1/0201 (2013.01); H05K 1/0274 (2013.01); H05K 5/03 (2013.01); H05K 5/065 (2013.01); H05K 5/069 (2013.01); H05K 7/20963 (2013.01); H05K 1/0306 (2013.01); H05K 1/0313 (2013.01); H05K 2201/10128 (2013.01);
Abstract
An encapsulation structure and a related display apparatus are provided. The encapsulation structure includes a first substrate having a sealing region; a metal pattern on the sealing region; a thermal conductive layer, at least covering the metal pattern and electrically insulated from the metal pattern; and a sealing structure on the thermal conductive layer.