The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Apr. 29, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Brian L. Carlson, Rochester, MN (US);

John R. Dangler, Rochester, MN (US);

Roger S. Krabbenhoft, Rochester, MN (US);

Kevin A. Splittstoesser, Stewartville, MN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/26 (2006.01); H05K 3/06 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01); H01P 3/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/26 (2013.01); H01P 3/02 (2013.01); H05K 1/0213 (2013.01); H05K 1/0237 (2013.01); H05K 1/0242 (2013.01); H05K 1/0298 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/06 (2013.01); H05K 3/064 (2013.01); H05K 3/382 (2013.01); H05K 3/46 (2013.01); H05K 1/0393 (2013.01); H05K 1/111 (2013.01); H05K 3/4611 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0391 (2013.01); Y10T 29/49117 (2015.01); Y10T 29/49124 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/49156 (2015.01);
Abstract

A circuit apparatus includes a first circuit feature upon a first insulator and a second circuit feature upon the first insulator. The first circuit feature includes a planarized surface and the second circuit feature includes an irregular surface. The first circuit feature and the second circuit feature may be formed from patterning a conductive sheet that is upon the first insulator. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions thereof and is maintained in second regions thereof. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.


Find Patent Forward Citations

Loading…