The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Apr. 14, 2017
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Se Jong Kim, Suwon-si, KR;
Won Gi Kim, Suwon-si, KR;
Thomas A Kim, Suwon-si, KR;
Jeong Hae Kim, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/367 (2006.01); H03F 3/21 (2006.01); H01L 23/373 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H03F 1/30 (2006.01); H05K 1/02 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H01L 23/3675 (2013.01); H01L 23/3677 (2013.01); H01L 23/3736 (2013.01); H01L 23/5389 (2013.01); H03F 1/30 (2013.01); H03F 3/21 (2013.01); H05K 1/0203 (2013.01); H05K 1/0204 (2013.01); H05K 3/0044 (2013.01); H05K 3/02 (2013.01); H05K 3/4611 (2013.01); H05K 3/4697 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/18 (2013.01); H01L 2924/181 (2013.01); H03F 2200/447 (2013.01); H05K 1/0209 (2013.01); H05K 3/005 (2013.01); H05K 3/0032 (2013.01); H05K 3/4644 (2013.01); H05K 2203/0191 (2013.01);
Abstract
A printed circuit board includes a board portion and an electronic element. The board portion includes a first substrate having an element accommodating portion and second substrates laminated on outer surfaces of the first substrate. The electronic element is disposed in the element accommodating part. The electronic element includes a heat generating element and a heat radiating member coupled to an inactive surface of the heat generating element.