The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Aug. 14, 2017
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Shinya Sasaki, Ebina, JP;
Tsuyoshi Kanki, Atsugi, JP;
FUJITSU LIMITED, Kawasaki, JP;
Abstract
A semiconductor device includes a printed circuit board that includes a first electrode, a resin substrate that includes a first face directed toward the printed circuit board, a second electrode formed in a second portion surrounding a first portion of the first face, a second face opposite the first face, and a third electrode formed in a third portion of the second face, the third portion overlapping the first portion in a plan view, a semiconductor chip that includes a coupling terminal joined to the third electrode, a conductive member that is formed between the printed circuit board and the resin substrate and contains a conductive particle and resin, and a solder bump that is formed between the printed circuit board and the resin substrate and is joined to the first electrode and the second electrode.