The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
May. 10, 2017
Power Wave Electronic Co., Ltd., Taipei, TW;
Wen-Jiao Liao, Taipei, TW;
Wei-Hong Tsai, Taipei, TW;
POWER WAVE ELECTRONICS CO., LTD., Taipei, TW;
Abstract
A method for manufacturing chip signal elements includes steps as follows. A substrate is provided. A plurality of through holes is drilled, and a plurality of side holes is formed along the through holes. A first cooper-plating process is performed to form a plurality of conductive layers electrically connected to the upper and the lower metal layer. A second cooper-plating process is performed to increase thickness of the conductive layers. A first and a second pattern layers are formed on the substrate by an etching. The first pattern layer is electrically connected to the second pattern layer to form a spiral radiator. An ink is printed on the substrate to cover the spiral radiator and form a solder mask layer. An organic metal process and a plating process are performed to form terminal electrodes. Finally, a single chip signal element having a spiral radiator is formed.