The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Nov. 05, 2018
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventor:
Hiroshi Nishikawa, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/113 (2013.01); H05K 1/029 (2013.01); H05K 1/0231 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/18 (2013.01); H05K 3/3442 (2013.01); H05K 2201/0305 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/173 (2013.01);
Abstract
A module component includes a substrate; first, second, third and fourth main electrodes on or in a principal surface of the substrate; a sub-electrode located between two of the four main electrodes and connected to one of the four main electrodes by a solder; a first mount component mounted to the first and second main electrodes; and a second mount component mounted to the third and fourth main electrodes; wherein an area of the sub-electrode is smaller than an area of each of the first, second, third and fourth main electrodes.