The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

May. 29, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

James A. Busby, New Paltz, NY (US);

Arthur J. Higby, Cottekill, NY (US);

David C. Long, Wappingers Falls, NY (US);

Michael J. Fisher, Poughkeepsie, NY (US);

Russell A. Budd, North Salem, NY (US);

Michel Turgeon, Bromont, CA;

Sylvain Tetreault, Bromont, CA;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 5/02 (2006.01); H05K 1/18 (2006.01); H05K 3/06 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0275 (2013.01); H05K 1/18 (2013.01); H05K 3/0035 (2013.01); H05K 3/06 (2013.01); H05K 3/4644 (2013.01); H05K 5/0208 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/107 (2013.01);
Abstract

Tamper-respondent assemblies are provided which include an enclosure assembly mounted to a circuit board and enclosing an electronic component(s) within a secure volume. The enclosure assembly includes an enclosure with an edge surface coupled to the circuit board, and a tamper-respondent sensor. The tamper-respondent sensor covers the edge surface and an inner surface of the enclosure. The sensor includes multiple layers, and at least one tamper-detect circuit. The tamper-detect circuit(s) includes a conductive trace(s) in a tamper-detect pattern covered, at least in part, by at least one layer of the multiple layers. The at least one layer is partially removed to provide exposed regions and unexposed regions of the conductive trace(s) at the edge surface of the enclosure. The conductive trace(s) is contacted where exposed by an adhesive securing the sensor to the circuit board. A monitor circuit monitors the tamper-detect circuit(s) for a tamper event.


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