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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10594288 B1

PDFFull Text
Date of Patent:
Mar. 17, 2020

Filed:

Sep. 05, 2018

Multilayer resonant circuit component, packaged multilayer resonant circuit component, and multilayer resonant circuit component manufacturing method

Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Rikiya Sano, Nagaokakyo, JP;

Shimpei Tanabe, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Rakesh B Patel

Int. Cl.
CPC ...
H03H 7/01 (2006.01); H01F 17/00 (2006.01); H05K 1/16 (2006.01); H01G 4/005 (2006.01); H01G 4/40 (2006.01); H01G 4/012 (2006.01); H03H 1/00 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0115 (2013.01); H01F 17/0013 (2013.01); H01F 17/0033 (2013.01); H01G 4/005 (2013.01); H01G 4/012 (2013.01); H01G 4/40 (2013.01); H03H 7/1741 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H01G 4/30 (2013.01); H03H 2001/0085 (2013.01);
Abstract

A multilayer resonant circuit component includes a multilayer body in which first electrode layers, which are provided with both coil patterns and capacitor patterns that constitute an LC circuit, are stacked with first insulator layers interposed therebetween. The multilayer body further includes, stacked together with a second insulator layer, at least one of the following: one or more second electrode layers that each include only a capacitor pattern; and a third electrode layer that includes only a coil pattern.

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Sano, Rikiya. (2020). Multilayer resonant circuit component, packaged multilayer resonant circuit component, and multilayer resonant circuit component manufacturing method (U.S. Patent No. 10594288). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10594288

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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