The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
May. 11, 2017
Autonetworks Technologies, Ltd., Yokkaichi-shi, Mie, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi-shi, Mie, JP;
Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;
Yoshimasa Shirai, Yokkaichi, JP;
Yasushi Saitoh, Yokkaichi, JP;
Kingo Furukawa, Yokkaichi, JP;
Tetsuhiko Kawasaki, Yokkaichi, JP;
Masayuki Ookubo, Yokkaichi, JP;
Hajime Watanabe, Yokkaichi, JP;
Yoshiyasu Tsuchiya, Yokkaichi, JP;
Akihiro Kato, Yokkaichi, JP;
AUTONETWORKS TECHNOLOGIES, LTD., Mie, JP;
SUMITOMO WIRING SYSTEMS, LTD., Yokkaichi-shi, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, JP;
Abstract
It is aimed to provide a press-fit terminal connection structure in which a board connecting portion of a press-fit terminal is press-fit into a through hole provided in a printed circuit board and which can combine the suppression of scraping of a surface layer and a reduction of a necessary load when the press-fit terminal is inserted into and withdrawn from the through hole and an improvement of a holding force for keeping the press-fit terminal inserted in the through hole. In the press-fit terminal connection structure, the press-fit terminal includes, at least on a surface of the contact point portion, an alloy containing layer mainly containing tin and palladium, and the through hole includes a tin layer on an outermost surface of an inner peripheral surface including at least the contact point portion.