The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Oct. 25, 2016
Applicant:

Furuno Electric Co., Ltd., Hyogo, JP;

Inventors:

Takehiro Kishida, Hyogo, JP;

Shuhei Inoue, Hyogo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/00 (2006.01); H01P 3/08 (2006.01); H01P 5/02 (2006.01); G01S 7/03 (2006.01); H01P 1/212 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01P 3/006 (2013.01); G01S 7/032 (2013.01); H01P 1/212 (2013.01); H01P 3/003 (2013.01); H01P 3/08 (2013.01); H01P 3/082 (2013.01); H01P 5/028 (2013.01); H05K 1/0216 (2013.01); H05K 1/115 (2013.01); H01P 5/022 (2013.01); H05K 2201/0195 (2013.01);
Abstract

To provide a multilayer substrate for transmitting/receiving a high frequency signal, the substrate having a simplified configuration and excellent high frequency characteristics. This disclosure pertains to a multilayer substrate provided with: a plurality of dielectric layers laminated together with ground layers interposed therebetween; and a signal line for inputting and outputting a signal, the signal line being formed on the surface of the dielectric layer. The plurality of ground layers include an input-side ground layer part formed in the region on the signal-input side of the signal line, an output-side ground layer part formed in the region on the signal-output side of the signal line, and an intermediate ground layer part formed in the region between the input-side ground layer part and the output-side ground layer part. The input-side ground layer part and the output-side ground layer part each have fewer layers than the intermediate ground layer part.


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