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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10593989 B1

PDFFull Text
Date of Patent:
Mar. 17, 2020

Filed:

Jun. 20, 2016

Method for manufacturing aluminum plate, aluminum plate, collector for storage device, and storage device

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Atsushi Matsuura, Shizuoka, JP;

Yuichi Kasuya, Shizuoka, JP;

Junji Kawaguchi, Shizuoka, JP;

Hisashi Hotta, Shizuoka, JP;

Yoshinori Hotta, Shizuoka, JP;

Hiroshi Komatsu, Shizuoka, JP;

Hirokazu Sawada, Shizuoka, JP;

Assignee:

FUJIFILM Corporation, Minato-ku, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

David Sample

Assistant Examiner:

Mary I Omori

Int. Cl.
CPC ...
B32B 3/10 (2006.01); C25D 1/08 (2006.01); H01M 10/0525 (2010.01); C25D 11/24 (2006.01); C25F 3/04 (2006.01); H01G 11/70 (2013.01); H01G 11/84 (2013.01); H01M 4/66 (2006.01); H01M 4/80 (2006.01); H01G 11/68 (2013.01); C25D 11/18 (2006.01); C25D 11/20 (2006.01); H01M 4/04 (2006.01); C23C 18/54 (2006.01); C23C 18/16 (2006.01); C25D 3/38 (2006.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01M 10/0525 (2013.01); C25D 11/18 (2013.01); C25D 11/20 (2013.01); C25D 11/24 (2013.01); C25F 3/04 (2013.01); H01G 11/68 (2013.01); H01G 11/70 (2013.01); H01G 11/84 (2013.01); H01M 4/044 (2013.01); H01M 4/0442 (2013.01); H01M 4/661 (2013.01); H01M 4/664 (2013.01); H01M 4/667 (2013.01); H01M 4/80 (2013.01); C23C 18/1653 (2013.01); C23C 18/54 (2013.01); C25D 3/38 (2013.01); H01M 2004/021 (2013.01); Y02E 60/13 (2013.01); Y02T 10/7011 (2013.01); Y02T 10/7022 (2013.01);
Abstract

An object of the present invention is to provide a method for manufacturing an aluminum plate which is simple, is high in productiveness, allows the use of arbitrary aluminum materials, and can be suitably used for collectors having excellent adhesiveness to active material layers, a collector for a storage device, and a storage device. The method for manufacturing an aluminum plate of the present invention is a method for manufacturing an aluminum plate having an aluminum substrate having a plurality of through holes in a thickness direction, including an oxidized film-forming step of forming an oxidized film by carrying out an oxidized film-forming treatment on a surface of the aluminum substrate having a thickness in a range of 5 μm to 1,000 μm and a through hole-forming step of forming through holes by carrying out an electrochemical dissolution treatment after the oxidized film-forming step.

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