The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Oct. 14, 2016
Applicant:
Bloom Energy Corporation, Sunnyvale, CA (US);
Inventors:
Harald Herchen, Los Altos, CA (US);
Matthias Gottmann, Sunnyvale, CA (US);
Ian Russell, Sunnyvale, CA (US);
Jonathan Cerrona, Fremont, CA (US);
Cheng-yu Lin, Sunnyvale, CA (US);
Assignee:
BLOOM ENERGY CORPORATION, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/093 (2006.01); B22F 3/03 (2006.01); B30B 11/02 (2006.01); B22F 5/00 (2006.01); H01M 8/0208 (2016.01); H01M 8/0206 (2016.01); B22F 7/08 (2006.01); H01M 8/0232 (2016.01); B30B 15/30 (2006.01); B30B 15/00 (2006.01); H01M 8/12 (2016.01); H01M 8/124 (2016.01); H01M 8/0228 (2016.01); H01M 8/021 (2016.01);
U.S. Cl.
CPC ...
H01M 8/0208 (2013.01); B22F 3/03 (2013.01); B22F 3/093 (2013.01); B22F 5/00 (2013.01); B22F 7/08 (2013.01); B30B 11/02 (2013.01); B30B 11/022 (2013.01); B30B 15/00 (2013.01); B30B 15/30 (2013.01); B30B 15/308 (2013.01); H01M 8/0206 (2013.01); H01M 8/0232 (2013.01); H01M 8/12 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); H01M 8/021 (2013.01); H01M 8/0228 (2013.01); H01M 2008/1293 (2013.01); H01M 2300/0074 (2013.01); Y02E 60/525 (2013.01);
Abstract
Methods for fabricating an interconnect for a fuel cell system that include forming a metal powder into a preform structure, positioning the preform structure in a die cavity of a press apparatus, and compressing the preform structure in the press apparatus to form the interconnect. Further embodiments include use of thin inserts in the die cavity to provide reduced permeability and/or including filler material in the die cavity.