The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Mar. 20, 2017
Applicant:
Applejack 199 L.p., Los Altos, CA (US);
Inventors:
Assignee:
APPLEJACK 199 L.P., Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/1395 (2010.01); H01M 4/36 (2006.01); H01M 4/04 (2006.01); H01M 4/38 (2006.01); H01M 10/052 (2010.01); H01M 4/134 (2010.01); H01M 10/0525 (2010.01); H01M 10/0565 (2010.01); H01M 10/058 (2010.01); B01J 19/12 (2006.01); B22F 1/00 (2006.01); B22F 9/28 (2006.01); C01B 33/029 (2006.01); H01M 4/62 (2006.01); H01M 2/16 (2006.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01M 4/364 (2013.01); B01J 19/126 (2013.01); B22F 1/0003 (2013.01); B22F 9/28 (2013.01); C01B 33/029 (2013.01); H01M 4/043 (2013.01); H01M 4/0471 (2013.01); H01M 4/134 (2013.01); H01M 4/1395 (2013.01); H01M 4/386 (2013.01); H01M 4/387 (2013.01); H01M 4/623 (2013.01); H01M 10/052 (2013.01); H01M 10/058 (2013.01); H01M 10/0525 (2013.01); H01M 10/0565 (2013.01); B01J 2219/0875 (2013.01); B01J 2219/1206 (2013.01); B22F 2301/30 (2013.01); B22F 2302/45 (2013.01); B22F 2304/10 (2013.01); B22F 2998/10 (2013.01); H01M 2/1653 (2013.01); H01M 2004/021 (2013.01); H01M 2004/027 (2013.01); H01M 2200/103 (2013.01); H01M 2220/20 (2013.01); H01M 2300/0025 (2013.01); H01M 2300/0068 (2013.01); H01M 2300/0082 (2013.01); Y02T 10/7011 (2013.01);
Abstract
A system and method of forming a silicon-hybrid anode material. The silicon-hybrid anode material including a microparticle mixture of a quantity of silicon microparticles and a quantity of metal microparticles intermixed with the quantity of silicon microparticles in a selected ratio. The microparticle mixture is formed in a silicon-hybrid anode material layer having a thickness of between about 2 and about 15 μm.