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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10593908 B1

PDFFull Text
Date of Patent:
Mar. 17, 2020

Filed:

Apr. 12, 2017

Encapsulation film

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Jung Ok Moon, Daejeon, KR;

Hyun Jee Yoo, Daejeon, KR;

Hyun Suk Kim, Daejeon, KR;

Jung Woo Lee, Daejeon, KR;

Se Woo Yang, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Dentons US LLP

Primary Examiner:

Thomas L Dickey

Int. Cl.
CPC ...
H01L 51/52 (2006.01); B32B 7/12 (2006.01); B32B 3/02 (2006.01); B32B 3/26 (2006.01); B32B 38/00 (2006.01); B32B 15/08 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); H01L 51/56 (2006.01); B32B 3/30 (2006.01); B32B 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); B32B 3/02 (2013.01); B32B 3/26 (2013.01); B32B 3/30 (2013.01); B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 15/08 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 38/0004 (2013.01); B32B 38/105 (2013.01); H01L 51/5259 (2013.01); H01L 51/56 (2013.01); B32B 2038/0076 (2013.01); B32B 2307/724 (2013.01); B32B 2307/7244 (2013.01); B32B 2307/7246 (2013.01); B32B 2310/0843 (2013.01); B32B 2457/00 (2013.01); B32B 2457/206 (2013.01); B32B 2581/00 (2013.01); H01L 2251/556 (2013.01); H01L 2251/558 (2013.01);
Abstract

The present application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The present application provides an encapsulation film which can be formed to have a structure in which moisture or oxygen flowing from the outside into an organic electronic device can be effectively blocked, has excellent handling properties and processability, and also has excellent bonding properties with an organic electronic element and durability.

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