The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Apr. 27, 2018
Applicant:
Nichia Corporation, Anan-shi, Tokushima, JP;
Inventors:
Teppei Kunimune, Tokushima, JP;
Masafumi Kuramoto, Tokushima, JP;
Assignee:
NICHIA CORPORATION, Anan-shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/16 (2006.01); H01L 33/62 (2010.01); H01B 1/22 (2006.01); B23K 35/30 (2006.01); B22F 1/00 (2006.01); B23K 35/02 (2006.01); B22F 3/10 (2006.01); H01L 23/00 (2006.01); B23K 35/36 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); B22F 1/0003 (2013.01); B22F 1/0014 (2013.01); B22F 1/0055 (2013.01); B22F 1/0074 (2013.01); B22F 3/1017 (2013.01); B23K 35/025 (2013.01); B23K 35/3006 (2013.01); B23K 35/3606 (2013.01); B23K 35/3607 (2013.01); H01B 1/16 (2013.01); H01B 1/22 (2013.01); H01L 24/26 (2013.01);
Abstract
Provided is a metal powder sintering paste having a high resistance to thermal stress. The present invention provides a metal powder sintering paste containing silver particles having an average particle diameter (median diameter) of 0.3 μm to 5 μm as a main component, further containing inorganic spacer particles having a CV value (standard deviation/average value) of less than 5%, and containing substantially no resin.