The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Jan. 11, 2018
Seoul Viosys Co., Ltd., Ansan-si, KR;
Jong Hyeon Chae, Ansan-si, KR;
Yeon Cheol Cho, Ansan-si, KR;
Cun Bok Jeong, Ansan-si, KR;
Hyoung Jin Lim, Ansan-si, KR;
SEOUL VIOSYS CO., LTD., Ansan-si, KR;
Abstract
A method for manufacturing a light emitting diode package comprises: arranging a first solder and a second solder between a substrate and a light emitting diode; and subjecting the first solder and the second solder to heat treatment to bond the substrate and the light emitting diode. The heat treatment comprises: increasing the temperature of the first and second solders from room temperature to a temperature Tp; maintaining the temperature Tp; and lowering the temperature Tp. The heating step comprises: a first ramping step of increasing a temperature from room temperature to a temperature Tat a constant speed; a pre-heating step of increasing the temperature from the temperature Tto a temperature Tto impart fluidity to the first and second solders; and a second ramping step of increasing the temperature from the Tto Tat a constant speed.