The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Feb. 27, 2018
Applicant:
Nichia Corporation, Anan-shi, Tokushima, JP;
Inventor:
Masatsugu Ichikawa, Tokushima, JP;
Assignee:
NICHIA CORPORATION, Anan-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 33/58 (2010.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01); C03C 27/08 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); C03C 27/08 (2013.01); H01L 24/83 (2013.01); H01L 33/0079 (2013.01); H01L 33/502 (2013.01); H01L 33/60 (2013.01); H01L 2224/83009 (2013.01); H01L 2224/8322 (2013.01); H01L 2224/83224 (2013.01); H01L 2224/83894 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract
A method of manufacturing an optical component for an optical semiconductor includes: providing a joined body including: a first member having light transmissivity and containing at least one element selected from the group consisting of oxygen, fluorine, and nitrogen, and a second member, wherein the first member and the second member are joined together via a metal joining member made by directly bonding a first metal film formed on the first member and a second metal film formed on the second member; and irradiating the joining member with a laser beam or a microwave.