The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Jun. 25, 2018
Applicant:

AU Optronics Corporation, Hsinchu, TW;

Inventors:

Cheng-Chieh Chang, Kaohsiung, TW;

Wen-Wei Yang, Changhua County, TW;

Cheng-Yeh Tsai, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/44 (2010.01); H01L 27/15 (2006.01); H01L 33/62 (2010.01); H01L 33/20 (2010.01); H01L 33/32 (2010.01); H01L 33/06 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/38 (2013.01); H01L 27/156 (2013.01); H01L 33/20 (2013.01); H01L 33/385 (2013.01); H01L 33/44 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 33/0075 (2013.01); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01);
Abstract

A light emitting device including a first semiconductor layer, a light emitting layer, a second semiconductor layer, a first electrode, and a second electrode is provided. The light emitting layer is deposited between the first and the second semiconductor layers. The first semiconductor layer, the light emitting layer and the second semiconductor layer form a stepped structure including a first electrode connection surface, a second electrode connection surface, and a connection portion. The first electrode connection surface is located on the first semiconductor layer. The second electrode connection surface is located on the second semiconductor layer. The connection portion connects the first and the second electrode connection surfaces. The connection portion includes a first surface, a second surface, and a third surface. A first corner s formed between the first and the second surfaces. A second corner is formed between the second and the third surfaces.


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