The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Oct. 12, 2018
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Po-Shun Chiu, Hsinchu, TW;

De-Shan Kuo, Hsinchu, TW;

Jhih-Jheng Yang, Hsinchu, TW;

Jiun-Ru Huang, Hsinchu, TW;

Jian-Huei Li, Hsinchu, TW;

Ying-Chieh Chen, Hsinchu, TW;

Zi-Jin Lin, Hsinchu, TW;

Assignee:

EPISTAR CORPORATION, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/22 (2010.01); H01L 33/10 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 33/22 (2013.01); H01L 33/10 (2013.01);
Abstract

A method of manufacturing a light-emitting device is disclosed. The method includes providing a light-emitting diode wafer, including a substrate and a semiconductor stack on the substrate, wherein the semiconductor stack has a lower surface facing the substrate and an upper surface opposite to the lower surface; providing a first laser on the light-emitting diode wafer and irradiating the light-emitting diode wafer from the upper surface to form a plurality of scribing lines on the upper surface; providing an etching process; providing and focusing a second laser on an interior of the substrate to form one or a plurality of textured areas in the substrate; and providing force on the light-emitting diode wafer to separate the light-emitting diode wafer into a plurality of light-emitting diode chips along the plurality of scribing lines.


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