The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Feb. 01, 2019
Applicant:

The Government of the United States of America, As Represented BY the Secretary of the Navy, Arlington, VA (US);

Inventors:

Woojun Yoon, Fairfax, VA (US);

David Scheiman, Alexandria, VA (US);

Phillip Jenkins, Cleveland Heights, OH (US);

Robert J. Walters, Alexandria, VA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 31/0224 (2006.01); H01L 31/0236 (2006.01);
U.S. Cl.
CPC ...
H01L 31/1868 (2013.01); H01L 31/02363 (2013.01); H01L 31/022441 (2013.01); H01L 31/1804 (2013.01); H01L 31/1892 (2013.01);
Abstract

A method for making an ultra-thin, flexible crystalline silicon solar cell from thick, inflexible cells. A thick, inflexible cell having a plurality of electrical contacts on the back side thereof is adhered to a mount by means of a temporary bonding adhesive tape and a thickness of the mounted stack. A thickness of the bonding tape and the back-side contacts is determined and compared to a desired thickness of the final cell. Excess material is ground from the front side of the stack to obtain a thinned stack having the desired thickness and the thinned stack is removed from the mount to produce an ultra-thin, flexible rear-contact Si solar cell having a total thickness of less than 80 μm and a bending radius of less than 20 mm. The front surface can be textured, with a passivation layer and/or a dielectric layer being deposited thereon.


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