The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Jul. 20, 2017
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, Anhui, CN;

Inventors:

Chengwei Liu, Beijing, CN;

Xinjie Zhang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/66 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); H01L 22/32 (2013.01); H01L 27/0288 (2013.01); H01L 27/0292 (2013.01); H01L 27/1259 (2013.01); H01L 27/1262 (2013.01); H01L 27/1222 (2013.01);
Abstract

The present disclosure relates to an array substrate assembly, a method of manufacturing the array substrate assembly, a display panel and a display apparatus. An array substrate assembly includes: a substrate; a first conducting wire on the substrate; a first insulating layer on the first conducting wire; a second conducting wire on the first insulating layer, wherein orthogonal projections of the first conducting wire and the second conducting wire on the substrate at least partly overlap, and at least one of the first conducting wire and the second conducting wire is constituted by a plurality of conducting segments arranged discontinuously; and a connection part configured to electrically connect adjacent ones of the conducting segments of the first conducting wire or the second conducting wire.


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