The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Mar. 08, 2018
Applicant:

Kabushiki Kaisha Tokai Rika Denki Seisakusho, Aichi, JP;

Inventors:

Narumasa Soejima, Aichi-ken, JP;

Takashi Suzuki, Aichi-ken, JP;

Kengo Shima, Aichi, JP;

Yosuke Kanie, Aichi, JP;

Kazuya Adachi, Aichi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/60 (2006.01); H01L 27/02 (2006.01); H01L 23/64 (2006.01); H01L 23/62 (2006.01); H01L 49/02 (2006.01); H02H 9/04 (2006.01); H01L 29/74 (2006.01); H01L 29/866 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0292 (2013.01); H01L 23/62 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 27/0251 (2013.01); H01L 27/0255 (2013.01); H01L 27/0288 (2013.01); H01L 28/10 (2013.01); H01L 28/20 (2013.01); H02H 9/04 (2013.01); H01L 29/74 (2013.01); H01L 29/866 (2013.01);
Abstract

A protection device includes a semiconductor substrate including a protection element; an insulating layer covering a surface of the semiconductor substrate; a conductive layer disposed in the insulating layer, and extending in a plane that is parallel with the surface of the semiconductor substrate; a passive element formed with an elongated conductor, curved in a plane that is parallel with the conductive layer, and located over the conductive layer; and an input terminal, an output terminal, and a ground terminal exposed in a surface of the insulating layer. One end of the passive element is electrically connected to the input terminal, the other end of the passive element and a high-potential-side terminal of the protection element are electrically connected to the output terminal, and a low-potential-side terminal of the protection element and the conductive layer are electrically connected to the ground terminal.


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