The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Sep. 04, 2018
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Satoshi Tsukiyama, Yokohama, JP;

Masaru Koyanagi, Ota, JP;

Mikihiko Ito, Ota, JP;

Kazushige Kawasaki, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01);
Abstract

A semiconductor device includes a base member, a stacked body on the base member, a first conductor on the stacked body, a second conductor on a top surface of the base member, and a connection conductor connecting the first conductor and the second conductor. The stacked body includes semiconductor chips stacked and a shared terminal connected to the plurality of semiconductor chips. The plurality of semiconductor chips each includes a functional element on a front surface side thereof and a through electrode extending from a back surface to the front surface side. The shared terminal has a top end positioned at a top surface of the stacked body and a bottom end positioned at a bottom surface of the stacked body. The first conductor is connected to the top end of the shared terminal, and the second conductor is electrically connected to the bottom end of the shared terminal.


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