The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Jul. 02, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-Do, KR;
Inventors:
Ilsoo Kim, Hwaseong-si, KR;
Heeyoub Kang, Seoul, KR;
Young-Rok Oh, Seoul, KR;
Kitaek Lee, Hwaseong-si, KR;
Hwi-Jong Yoo, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 23/544 (2006.01); H01L 25/10 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/3737 (2013.01); H01L 23/544 (2013.01); H01L 25/105 (2013.01); H05K 1/18 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54433 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01);
Abstract
A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.