IDiyas

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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10593635 B1

PDFFull Text
Date of Patent:
Mar. 17, 2020

Filed:

Mar. 27, 2018

Multi-die and antenna array device

Applicant:

Nxp B.v., Eindhoven, NL;

Inventors:

Antonius Hendrikus Jozef Kamphuis, Lent, NL;

Paul Southworth, Groesbeek, NL;

Keith Richard Sarault, Nijmegen, NL;

Marcellinus Johannes Maria Geurts, Amsterdam, NL;

Jeroen Johannes Maria Zaal, Nijmegen, NL;

Johannes Henricus Johanna Janssen, Venray, NL;

Amar Ashok Mavinkurve, Malden, NL;

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:

Charlene R. Jacobsen

Primary Examiner:

Anthony Ho

Assistant Examiner:

Mohammad M Hoque

Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/427 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01P 5/16 (2006.01); H01Q 1/22 (2006.01); H01Q 21/00 (2006.01); H01Q 1/52 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4853 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/3171 (2013.01); H01L 23/427 (2013.01); H01L 23/5227 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/96 (2013.01); H01P 5/16 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/523 (2013.01); H01Q 21/00 (2013.01); H01L 24/13 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/14133 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/214 (2013.01); H01L 2224/95001 (2013.01); H01L 2924/18162 (2013.01);
Abstract

Embodiments are provided for a multi-die packaged semiconductor device including: a panel of embedded dies including a plurality of radio frequency (RF) dies, wherein each RF die includes RF front-end circuitry, each RF die has an active side that includes a plurality of pads, each RF die has a back side exposed in a back side of the panel; a plurality of antenna connectors formed on a subset of the plurality of pads of each RF die; and an array of antennas formed over a front side of the panel and connected to the plurality of antenna connectors.

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