The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Sep. 13, 2016
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Shigeto Fujita, Tokyo, JP;

Tetsuya Matsuda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/60 (2006.01); H01L 25/07 (2006.01); H01L 23/051 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/60 (2013.01); H01L 23/051 (2013.01); H01L 23/48 (2013.01); H01L 24/72 (2013.01); H01L 25/07 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

It is an object of the present invention to provide a semiconductor module which suppresses a break in a current path and occurrence of arc discharge when a semiconductor chip is short-circuited. A semiconductor moduleaccording to the present invention includes at least one semiconductor chip, a housingin which the semiconductor chipis stored, and at least one pressurizing member which is placed between an upper electrodeof the semiconductor chipand an upper-side electrodeprovided in the housingand electrically connects the upper electrodeand the upper-side electrode, the pressurizing memberis elastic, and the pressurizing memberincludes a conductive blockand a plate spring memberincluding current pathsandwhich are opposed to each other with at least a part of the conductive blocklocated between the current pathsand


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Fujita, Shigeto. (2020). Semiconductor module (U.S. Patent No. 10593633). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10593633

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