The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Jul. 27, 2018
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Samuele Sciarrillo, Usmate Velate, IT;
Ivan Venegoni, Bareggio, IT;
Paolo Colpani, Agrate Brianza, IT;
Francesca Milanesi, Milan, IT;
STMICROELECTRONICS S.R.L., Agrate Brianza, IT;
Abstract
A semiconductor device includes a passivation layer over a dielectric layer, a via through the passivation layer and the dielectric layer, an interconnection metallization arranged over said at least one via; said passivation layer underlying peripheral portions of said interconnection metallization, and an outer surface coating that coats said interconnection metallization. The coating preferably includes at least one of a nickel or nickel alloy layer and a noble metal layer. The passivation layer is separated from the peripheral portion of the interconnection metallization by a diffusion barrier layer, preferably a titanium or a titanium alloy barrier. The device includes a dielectric layer arranged between the passivation layer and the diffusion barrier layer; and a hollow recess area between the passivation layer and the end portion of the barrier layer and between the passivation layer and the foot of the outer surface coating.