IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10593613 B1

PDFFull Text
Date of Patent:
Mar. 17, 2020

Filed:

Mar. 04, 2015

Lead frame and semiconductor package including the same

Applicant:

Bk Technology Co., Ltd, Gyeonggi-do, KR;

Inventor:

Dong-Woo Lee, Gyeonggi-do, KR;

Assignee:

BK Technology Co., Ltd., Gyeonggi-do, KR;

Attorney:

Blank Rome LLP

Primary Examiner:

Feifei Yeung Lopez

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 23/31 (2006.01); H01L 25/075 (2006.01); F21Y 115/10 (2016.01); F21S 4/00 (2016.01); F21Y 103/10 (2016.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 23/315 (2013.01); H01L 23/495 (2013.01); H01L 23/49575 (2013.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H01L 33/642 (2013.01); H01L 33/647 (2013.01); F21S 4/00 (2013.01); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08); H01L 25/0753 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01);
Abstract

Disclosed are a lead frame for a semiconductor package, comprising: an anode, a cathode, a molding part, terminal partsand, wherein one or more heat radiating holes, one or more chip attachment partswhich have a wider surface area than surface areas of semiconductor chipsto be attached, one or more upper openingsandare positioned in an upper portion of the lead frame, and wherein one or more heat radiating holes, one or more first lower openings, and one or more second lower openingsare positioned in a lower portion of the lead frame; a semiconductor package including the lead frame; and a lighting apparatus including the semiconductor package.

Find Patent Forward Citations

Loading…