The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Jan. 03, 2018
Applicant:

Samtec, Inc., New Albany, IN (US);

Inventors:

Fred Koelling, Foster City, CA (US);

Alan P. Nolet, Hillsborough, CA (US);

Daniel Long, Eldorado Hills, CA (US);

Assignee:

SAMTEC, INC., New Albany, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/498 (2006.01); B22F 7/08 (2006.01); B22F 3/15 (2006.01); B22F 1/02 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); B22F 1/025 (2013.01); B22F 3/15 (2013.01); B22F 7/08 (2013.01); H01L 23/49827 (2013.01); B22F 2301/25 (2013.01); H01L 23/15 (2013.01); H01L 23/49866 (2013.01);
Abstract

A method to reduce the number and type of processing steps to achieve conductive lines in the planes of a substrate concurrently interconnecting conductor through the substrate, by forming structures in the planes of a substrate. These structures may include interconnect lines, bond pads, and other structures, and improve the performance of subsequent unique processing while simultaneously reducing the manufacturing complexity to reduce time and cost. These structures are formed by selective etching using chemical mechanical polishing, and then completed using a single fill step with a conductive material.


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