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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10593554 B1

PDFFull Text
Date of Patent:
Mar. 17, 2020

Filed:

Mar. 30, 2018

Method and apparatus for within-wafer profile localized tuning

Applicant:

Jun Yang, Hayward, CA (US);

Inventor:

Jun Yang, Hayward, CA (US);

Assignee:

Other;

Attorney:

Knobbe, Martens, Olson & Bear, LLP

Primary Examiner:

Sylvia MacArthur

Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/687 (2006.01); G02F 1/13 (2006.01); H01L 21/306 (2006.01); H01L 21/3105 (2006.01); H01L 21/683 (2006.01); B24B 37/10 (2012.01); B24B 37/005 (2012.01); G05B 19/418 (2006.01); H01L 21/66 (2006.01); H01L 21/02 (2006.01); B24B 37/20 (2012.01);
U.S. Cl.
CPC ...
H01L 21/31053 (2013.01); B24B 37/005 (2013.01); B24B 37/107 (2013.01); B24B 37/20 (2013.01); G05B 19/4189 (2013.01); H01L 21/02024 (2013.01); H01L 21/6838 (2013.01); H01L 21/68735 (2013.01); H01L 22/20 (2013.01); G05B 2219/45031 (2013.01); G05B 2219/49104 (2013.01); H01L 22/12 (2013.01);
Abstract

A method and apparatus for within-wafer profile localized tuning is disclosed. In one aspect, the method includes providing a wafer attached to a rotating vacuum stage front side up, the wafer including a surface film with an incoming film thickness profile, providing a pad attached to a rotating head front side down, the head configured to sweep along a path, computing a film thickness removal amount based upon the incoming film thickness profile, and removing at least a portion of the surface film of the wafer based on the computed film thickness removal amount via a plurality of steps.

Find Patent Forward Citations

Yang, Jun. (2020). Method and apparatus for within-wafer profile localized tuning (U.S. Patent No. 10593554). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10593554

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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