The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Mar. 22, 2018
Applicant:
Fujifilm Electronic Materials U.s.a., Inc., N. Kingstown, RI (US);
Inventors:
William A. Wojtczak, Austin, TX (US);
Keeyoung Park, Gilbert, AZ (US);
Atsushi Mizutani, Woluwe Saint Lambert, BE;
Assignee:
Fujifilm Electronic Materials U.S.A., Inc., N. Kingstown, RI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C09D 5/00 (2006.01); C09D 7/20 (2018.01); B08B 3/08 (2006.01); C11D 11/00 (2006.01); H01L 21/321 (2006.01); H01L 21/3105 (2006.01); H01L 21/306 (2006.01); C09D 7/63 (2018.01);
U.S. Cl.
CPC ...
H01L 21/02052 (2013.01); B08B 3/08 (2013.01); C09D 5/008 (2013.01); C09D 7/20 (2018.01); C11D 11/0047 (2013.01); H01L 21/02057 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/02334 (2013.01); H01L 21/306 (2013.01); H01L 21/3105 (2013.01); H01L 21/321 (2013.01); C09D 7/63 (2018.01);
Abstract
The disclosure provides methods and compositions therefor for treating a surface wherein a surface treatment layer is formed on the surface, thereby minimizing or preventing pattern collapse as the surface is subjected to typical cleaning steps in the semiconductor manufacturing process.