The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Sep. 08, 2015
Applicant:

Hitachi Metals, Ltd., Minato-ku, Tokyo, JP;

Inventor:

Shuji Mino, Mishima-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 41/02 (2006.01); B22F 3/24 (2006.01); H01F 1/057 (2006.01); B22F 3/10 (2006.01); C22C 28/00 (2006.01); C22C 38/00 (2006.01); H01F 1/08 (2006.01); B22F 1/00 (2006.01); B22F 7/00 (2006.01); B22F 7/02 (2006.01); B22F 9/08 (2006.01); C21D 6/00 (2006.01); C22C 38/06 (2006.01); C22C 38/10 (2006.01); C22C 38/16 (2006.01); C22F 1/16 (2006.01); C22C 1/04 (2006.01);
U.S. Cl.
CPC ...
H01F 41/0266 (2013.01); B22F 1/0059 (2013.01); B22F 3/1017 (2013.01); B22F 3/24 (2013.01); B22F 7/008 (2013.01); B22F 7/02 (2013.01); B22F 9/082 (2013.01); C21D 6/007 (2013.01); C22C 28/00 (2013.01); C22C 38/00 (2013.01); C22C 38/002 (2013.01); C22C 38/005 (2013.01); C22C 38/06 (2013.01); C22C 38/10 (2013.01); C22C 38/16 (2013.01); C22F 1/16 (2013.01); H01F 1/057 (2013.01); H01F 1/0577 (2013.01); H01F 1/08 (2013.01); H01F 41/02 (2013.01); B22F 2003/248 (2013.01); B22F 2202/01 (2013.01); B22F 2202/05 (2013.01); B22F 2301/35 (2013.01); B22F 2301/45 (2013.01); B22F 2302/25 (2013.01); B22F 2302/45 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C22C 1/0416 (2013.01); C22C 1/0425 (2013.01); C22C 1/0433 (2013.01); C22C 2202/02 (2013.01);
Abstract

A step of, while a powder of an RLM alloy (where RL is Nd and/or Pr; M is one or more elements selected from among Cu, Fe, Ga, Co, Ni and Al) which is produced through atomization and a powder of an RH compound (where RH is Dy and/or Tb) are present on the surface of a sintered R-T-B based magnet, performing a heat treatment at a sintering temperature of the sintered R-T-B based magnet or lower is included. The RLM alloy contains RL in an amount of 65 at % or more, and the melting point of the RLM alloy is equal to or less than the temperature of the heat treatment. The heat treatment is performed while the RLM alloy powder and the RH compound powder are present on the surface of the sintered R-T-B based magnet at a mass ratio of RLM alloy:RH compound=9.6:0.4 to 5:5.


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